International Journal of Modern Physics and Applications
Articles Information
International Journal of Modern Physics and Applications, Vol.1, No.4, Sep. 2015, Pub. Date: Aug. 17, 2015
Thin Film Deposition Processes
Pages: 193-199 Views: 3282 Downloads: 4889
[01] Dler Adil Jameel, School of Physics and Astronomy, Nottingham Nanotechnology and Nanoscience Center University of Nottingham, Nottingham, United Kingdom; Department of Physics, Faculty of Science, University of Zakho, Duhok, Kurdistan Region, Iraq.
During the last many decades the methods of forming thin films materials have increased significantly. In general, thin film is a small thickness that produces by physical vapour deposition (PVD) and chemical vapour deposition (CVD). Despite the PVD technique has a few drawbacks, it remains an important method and more beneficial than CVD technique for depositing thin films materials. This project examines some remarkable similarities and differences between PVD and CVD systems as well as evaluates the different techniques of depositing thin film. The majority of researchers have attempted to explain and justify the most precise system for depositing thin film since it is important in several applications such as surgical/medical and automotive. It is concluded that the most efficient method of depositing is PVD process. In addition, it has been found that there are more differences than similarities between PVD and CVD processes.
Thin Film, Physical Vapour Deposition (PVD), and Chemical Vapour Deposition (CVD)
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